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Carnegie Mellon University | Software Engineering Institute

TechDebt 2019

In conjunction with ICSE 2019

Montréal, QC, Canada    May 26–27, 2019

Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term but set up a technical context that can make future changes more costly or impossible. Software developers and managers increasingly use the concept to communicate key tradeoffs related to release and quality issues. As the interest in technical debt from our industry steadily grows, the TechDebt Conference serves as the key venue to share successful analysis and management approaches used in software development organizations, emerging practices, and research results.

The International Conference on Technical Debt is sponsored by IEEE TCSE and ACM SIGSOFT. The full TechDebt 2019 website is integrated with ICSE at https://2019.icse-conferences.org/track/TechDebt-2019.

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Call for Papers

The Second International Conference on Technical Debt will be held in Montréal, QC, Canada, on May 26–27, 2019, collocated with ICSE 2019.

Technical debt is a metaphor that software developers and managers increasingly use to communicate key tradeoffs between time to market and quality issues.

While other software engineering disciplines—such as software sustainability, maintenance and evolution, refactoring, software quality, and empirical software engineering—have produced results relevant to managing technical debt, none of them alone suffice to model, manage, and communicate the different facets of the design tradeoff problems involved in managing technical debt. Similarly, while many software engineering practices can be used to get ahead of technical debt, organizations struggle with managing technical debt routinely and strategically.

TechDebt 2019 aims to bring together leading software engineering researchers and practitioners to explore theoretical and practical techniques for managing technical debt and to share experiences, challenges, and best practices.

The conference addresses all topics related to technical debt in two tracks:

  • Main track: research papers, experience papers, and short papers
  • Tools track: panel participants, tool demonstrations, and posters

Accepted submissions will be published as part of the ICSE co-located events proceedings. Learn more about submission guidelines on the ICSE TechDebt 2019 website.

Calendar for submission:

  • January 15: Abstract submitted to EasyChair
  • January 22: Full papers entered in EasyChair
  • March 1: Notification of acceptance/rejection
  • March 15: Camera-ready submission of final paper
  • May 26–27: Presentations

Organizing Committee

General Chair: Ipek Ozkaya, Software Engineering Institute, US
Program Co-Chair: Paris Avgeriou, University of Groningen, NL
Program Co-Chair: Klaus Schmid, Stiftung University Hildesheim, DE
Tools Co-Chair: Neil Ernst, University of Victoria, CA
Tools Co-Chair: Magiel Bruntink, Software Improvement Group, NL
Proceedings: Zadia Codabux, Colby College, US
Local Arrangements: Emad Shihab, Concordia University, CA
Publicity: Antonio Martini, University of Oslo, NO
Web: Tamara Marshall-Keim, Software Engineering Institute, US

Montréal, QC, Canada

Venue: Fairmont, the Queen Elizabeth Hotel

900 Rene Levesque Blvd. W
H3B 4A5
Montréal, QC
Canada

Visit website

Sponsors

ACM
SigSoft