TechDebt 2018

TechDebt 2018

In conjunction with ICSE 2018

Gothenburg, Sweden May 27–28, 2018

Go to TechDebt 2018 Website

Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term but set up a technical context that can make future changes more costly or impossible. Software developers and managers increasingly use the concept to communicate key tradeoffs related to release and quality issues. The goal of this two-day conference is to bring together leading software researchers, practitioners, and tool vendors to explore theoretical and practical techniques that manage technical debt.

The International Conference on Technical Debt is sponsored by IEEE TCSE and ACM SIGSOFT. The full TechDebt 2018 website is integrated with ICSE at techdebtconf.org.

Join our mailing list to receive updates about TechDebt 2018.

Call for Papers

The First International Conference on Technical Debt will be held in Gothenburg, Sweden, on May 27–28, 2018, collocated with ICSE 2018.

Technical debt is a metaphor that software developers and managers increasingly use to communicate key tradeoffs related to release and quality issues. The Managing Technical Debt workshop series had, since 2010, brought together practitioners and researchers to discuss and define issues related to technical debt and how they can be studied. Workshop participants reiterated the usefulness of the concept each year, shared emerging practices used in software development organizations, and emphasized the need for more research and better means for sharing emerging practices and results.

As the interest from our industry and academic researchers in technical debt has steadily grown, the workshop series has morphed into a full conference in 2018. Our goal for this Conference on Technical Debt is to bring together leading software engineering researchers and practitioners for the purpose of exploring theoretical and practical techniques for managing technical debt.

The following topics are aligned with the conference theme:

  • identification of technical debt
  • visualization of technical debt
  • analysis of technical debt
  • metrics for technical debt
  • economic models for describing or reasoning about technical debt
  • understanding causes and effects of technical debt
  • relationship of technical debt to software evolution, maintenance, and aging
  • relationship of technical debt to other activities, such as testing or requirement elicitation
  • the business case for technical debt management
  • technical debt and software lifecycle management
  • technical debt within a software ecosystem
  • technical debt in designs and architecture
  • technical debt in software models
  • techniques and tools for calculating technical debt principal and interest
  • concrete practices and tools used to measure and control technical debt
  • education related to technical debt

We invite submissions of papers in any areas related to the theme and goal of the conference in the following three categories:

  • Research Papers: describing innovative and significant original research in the field (up to 10 pages)
  • Industrial Papers: describing industrial experience, case studies, challenges, problems, and solutions (up to 10 pages)
  • Short Papers: Position and Future Trend Papers: describing ongoing research and new results (up to 5 pages)

Submissions must be original and unpublished work. Each submitted paper will undergo a rigorous review process by three members of the program committee. Submissions must be submitted online via the TechDebtConf2018 EasyChair conference management system and conform to the ICSE formatting guidelines.

Accepted papers must be presented in person at the conference by one of the authors.

Calendar for submission:

  • January 15: Abstract submitted to EasyChair
  • January 22: Full papers entered in EasyChair
  • March 1: Notification of acceptance/rejection
  • March 15: Camera-ready submission of final paper
  • May 27–28: Presentations

Organization Committee

General Chair: Robert L. Nord, Software Engineering Institute, US
Program Co-Chair: Frank Buschmann, Siemens, DE
Program Co-Chair: Philippe Kruchten, UBC, CA
Proceedings: Carolyn Seaman, UMBC, US
Publicity: Davide Falessi, California Polytechnic State University, US
Tools: Clemente Izurieta, Montana State University, US
Local Arrangements: Antonio Martini, Chalmers, SE
Web: Tamara Marshall-Keim, Software Engineering Institute, US

Steering Committee

Paris Avgeriou, University of Groningen, NL
Philippe Kruchten, University of British Columbia, CA
Robert L. Nord, Software Engineering Institute, US
Ipek Ozkaya, Software Engineering Institute, US
Carolyn Seaman, University of Maryland Baltimore County, US

Gothenburg, Sweden

Gothenburg, Sweden

Venue: Congress Centre Gothia Towers

Mässans gata 24
412 51
Gothenburg
Sweden

Visit website

Sponsors

ACM
ECSI2018
IEEE
SigSoft
TCSE