Proceedings of the 2018 International Conference on Technical Debt
• Conference Paper
Publisher
ACM
Subjects
Abstract
The inaugural edition of the International Conference on Technical Debt, TechDebt 2018, was co-located with the 40th International Conference on Software Engineering (ICSE '18) in Göteborg, Sweden.
Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term but set up a technical context that can make future changes more costly or impossible. Software developers and managers increasingly use the concept to communicate key trade-offs related to release and quality issues.
The Managing Technical Debt workshop series has provided a forum since 2010 for practitioners and researchers to discuss issues related to technical debt and share emerging practices used in software-development organizations. A week-long Dagstuhl Seminar on Managing Technical Debt in Software Engineering has produced a consensus definition for technical debt, a draft conceptual model, and a research roadmap.
To accelerate progress, an expanded two-day working conference format has become essential. The goal of this two-day conference is to bring together leading software researchers, practitioners, and tool vendors to explore theoretical and practical techniques that manage technical debt.
Proceedings of TechDebt 2018 were published by ACM in ICSE '18: The 40th International Conference on Software Engineering, SIGSOFT.
This content was created for a conference series or symposium and does not necessarily reflect the positions and views of the Software Engineering Institute.