Software Engineering Institute | Carnegie Mellon University
Software Engineering Institute | Carnegie Mellon University

Digital Library

Technical Report

Packaging Predictable Assembly with Prediction-Enabled Component Technology

  • November 2001
  • By Scott Hissam, Gabriel Moreno, Judith A. Stafford, Kurt C. Wallnau
  • This report describes the major structures of a PECT. It then discusses the means of validating the predictive powers of a PECT so that consumers may obtain measurably bounded trust in design-time predictions.
  • Publisher: Software Engineering Institute
    CMU/SEI Report Number: CMU/SEI-2001-TR-024
  • Abstract

    This report describes the use of prediction-enabled component technology (PECT) as a means of packaging predictable assembly as a deployable product. A PECT results from integrating a component technology with one or more analysis technologies. Analysis technologies allow analysis and prediction of assembly-level properties prior to component assembly, and, presumably, prior to component acquisition. Analysis technologies also identify required component properties and their certifiable descriptions. This report describes the major structures of a PECT. It then discusses the means of validating the predictive powers of a PECT so that consumers may obtain measurably bounded trust in design-time predictions. Last, it demonstrates the above concepts in a simple but illustrative model problem: predicting average end-to-end latency of a soft real-time application built from off-the-shelf software components.

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Cite This Report

SEI

Hissam, Scott; Moreno, Gabriel; Stafford, Judith; & Wallnau, Kurt. Packaging Predictable Assembly with Prediction-Enabled Component Technology. CMU/SEI-2001-TR-024 . Software Engineering Institute, Carnegie Mellon University. 2001. http://resources.sei.cmu.edu/library/asset-view.cfm?AssetID=5719

IEEE

Hissam. Scott, Moreno. Gabriel, Stafford. Judith, and Wallnau. Kurt, "Packaging Predictable Assembly with Prediction-Enabled Component Technology," Software Engineering Institute, Carnegie Mellon University, Pittsburgh, Pennsylvania, Technical Report CMU/SEI-2001-TR-024 , 2001. http://resources.sei.cmu.edu/library/asset-view.cfm?AssetID=5719

APA

Hissam, Scott., Moreno, Gabriel., Stafford, Judith., & Wallnau, Kurt. (2001). Packaging Predictable Assembly with Prediction-Enabled Component Technology (CMU/SEI-2001-TR-024 ). Retrieved March 18, 2019, from the Software Engineering Institute, Carnegie Mellon University website: http://resources.sei.cmu.edu/library/asset-view.cfm?AssetID=5719

CHI

Scott Hissam, Gabriel Moreno, Judith Stafford, & Kurt Wallnau. Packaging Predictable Assembly with Prediction-Enabled Component Technology (CMU/SEI-2001-TR-024 ). Pittsburgh, PA: Software Engineering Institute, Carnegie Mellon University, 2001. http://resources.sei.cmu.edu/library/asset-view.cfm?AssetID=5719

MLA

Hissam, Scott., Moreno, Gabriel., Stafford, Judith., & Wallnau, Kurt. 2001. Packaging Predictable Assembly with Prediction-Enabled Component Technology (Technical Report CMU/SEI-2001-TR-024 ). Pittsburgh: Software Engineering Institute, Carnegie Mellon University. http://resources.sei.cmu.edu/library/asset-view.cfm?AssetID=5719

BibTex

@techreport{HissamPackagingPredictable2001,
title={Packaging Predictable Assembly with Prediction-Enabled Component Technology},
author={Scott Hissam and Gabriel Moreno and Judith Stafford and Kurt Wallnau},
year={2001},
number={CMU/SEI-2001-TR-024 },
institution={Software Engineering Institute, Carnegie Mellon University},
address={Pittsburgh, PA},
url={http://resources.sei.cmu.edu/library/asset-view.cfm?AssetID=5719} }